Veeco Releases New InSight 3D Atomic Force Microscope for Advanced Photomask Metrology
October 07, 2008
Plainview, NY, October 7, 2008 -- Veeco Instruments Inc. (Nasdaq: VECO), a leading provider of instrumentation to the nanoscience community, today introduced a new version of its InSight(TM) 3D Automated Atomic Force Microscope (3DAFM) specifically designed to deliver accurate three-dimensional metrology on advanced 32nm and 22nm photomasks. The InSight 3DAFM-PM incorporates a number of hardware and software enhancements to provide high throughput and sub-nanometer measurement uncertainty for critical dimension (CD) and depth metrology on a variety of photomask features and material types. In addition to semiconductor applications, the InSight 3DAFM-PM has been designed to meet the hard disk drive industry's challenging metrology requirements as it incorporates nano-imprint masks in new patterned media technology.
Mark R. Munch, Ph.D., Executive Vice President, Veeco Metrology commented, "The InSight 3DAFM-PM tool stands alone in its ability to provide non-destructive three dimensional profile metrology and production-based depth metrology for advanced masks. The system also enables significant improvements in cost of ownership, with improved throughput and a significant reduction in cost per measurement for CD metrology."
"The InSight 3DAFM-PM has already demonstrated capability on advanced 22nm node nano-imprint masks and is unique in its ability to measure accurate profile on this technology," states Paul Clayton, Vice President, Veeco's Automated AFM Business. "In addition, this platform enables process development times to be improved with full profile characterization of resist and MoSi structures as well as chrome and other mask materials."
About InSight 3DAFM-PM
The InSight 3DAFM-PM features an innovative metrology platform designed to meet the stringent requirements of 32 and 22nm advanced photomask and nano-imprint metrology applications, such as CD, sidewall angle and line width roughness on critical layers. The system contains a new high-precision X-Y stage with improved accuracy and a unique pattern recognition system with high-precision laser auto-focus capability. In addition, new
AFM control techniques and proprietary probe designs enable improved precision, lower cost per measurement site and smaller feature measurement. Finally, system reliability is significantly enhanced to meet the demands of 32 and 22nm production-based metrology. Further information on the InSight 3DAFM-PM can be found at www.veeco.com/insight3dafm .
Veeco Instruments Inc. designs, manufactures, markets and services enabling solutions for customers in the HB-LED, solar, data storage, semiconductor, scientific research and industrial markets. We have leading technology positions in our three businesses: LED & Solar Process Equipment, Data Storage Process Equipment, and Metrology Instruments. Veeco's product development, marketing, engineering and manufacturing facilities are located in New York, New Jersey, California, Colorado, Arizona, Massachusetts and Minnesota. Global sales and service offices are located throughout the U.S., Europe, Japan and Asia Pacific. http://www.veeco.com/
To the extent that this news release discusses expectations or otherwise makes statements about the future, such statements are forward-looking and are subject to a number of risks and uncertainties that could cause actual results to differ materially from the statements made. These factors include the risks discussed in the Business Description and Management's Discussion and Analysis sections of Veeco's Annual Report on Form 10-K for the year ended December 31, 2009 and in our subsequent quarterly reports on Form 10-Q, current reports on Form 8-K and press releases.Veeco does not undertake any obligation to update any forward-looking statements to reflect future events or circumstances after the date of such statements.